1、 Manufacturer introduction and application:

Model Phase12 thermal resistance tester is produced by American Analysis Tech (Anatech) Company, which conforms to the US military standard and JEDEC standard

Analysis Tech Inc., founded in 1983 and located in the north of Boston, is an international design and manufacturing company for reliability testing of electronic packaging devices. John W. Sofia, the founder, is a doctor of Massachusetts Institute of Technology and an expert who puts forward the theory of solder joint reliability, thermal resistance analysis and thermal conductivity He has published many papers on thermal resistance test in analysis, thermal conductivity and solder joint reliability Analysis Tech Inc. has an independent laboratory in the United States to provide technical support There are hundreds of famous customers in the world

It is mainly used to test and analyze the thermal resistance of diode, triode, linear voltage regulator, silicon controlled rectifier, LED, MOSFET, MESFET, IGBT, IC and other independent power devices.

2、 Functions of Phase12:

PHASE12 can test the thermal resistance of Rja, Rjc, Rjb and Rjl (the test principle conforms to the dynamic and static test methods defined by JEDEC51-1)

Figure 1

The data from Phase 12 test will generate the above figure. The figure in the upper left corner indicates that the device has four levels (in order to clearly understand different levels, this figure can be converted into Figure 3). The first one is the impedance value of the bonding layer under the chip, and the later Tau is the test time. The sum of the impedance values of the four layers is the thermal resistance value of the device. And every inflection point indicates that heat has entered a new

The hierarchy of. The data at each level will show whether the different layers of the device can dissipate heat. For similar products from different manufacturers, we can choose manufacturers with very good thermal resistance values; At the same time, it can also detect the quality difference of the same manufacturer, similar products and different batches, so as to evaluate the stability of the manufacturer's production process.

1) Thermal Impedance test can obtain the transient impedance data from the beginning of heating to the junction temperature reaching stability. See the figure above

2) Test of various parameters of thermal resistance, including Rja, Rjb, Rjc and Rjl, when the device is given a certain working current. The heat continuously diffuses outward, and finally reaches the thermal balance. At this time, the result is the steady-state thermal resistance value. The thermal impedance is measured before the thermal balance is reached.

3) The impedance and thermal resistance of square wave with different duty cycle can be obtained.

Figure II

4) The correlation analysis between the internal packaging structure and its heat dissipation capacity (Structure Function) can be done by converting similar Figure 1 into the curve analysis diagram (heat capacity and thermal resistance relationship diagram) shown below, which can better reflect the thermal resistance under different structures. Taking LED as an example, the bottleneck of the heat dissipation capacity of LED devices can be seen in the diagram, which is very helpful for the improvement of LED packaging process and the selection of packaging materials. The following figure shows the analysis diagram of LED samples with two different packaging structures.

This analysis diagram can be obtained not only for LED devices, but also for other devices. This analysis can also be obtained.